Bhubaneswar: A major push to Odisha’s ambitions in advanced electronics manufacturing was marked on Sunday with the foundation laying of a ₹2,000-crore 3D glass substrate packaging unit at Infovally in Khordha.
The project was inaugurated by Chief Minister Mohan Charan Majhi along with Union Minister Ashwini Vaishnaw. The facility, being established by 3D Glass Solutions, is expected to create around 2,500 jobs and strengthen Odisha’s position in the semiconductor value chain.
Describing the development as a turning point, Vaishnaw said the unit would introduce advanced glass substrate packaging technology in India for the first time, placing the country on the global semiconductor map in a new segment.
Echoing similar sentiments, the Chief Minister termed the project a “landmark” for Odisha’s industrial transformation. He noted that the facility would support cutting-edge sectors such as artificial intelligence, high-performance computing, and defence electronics, while also enhancing domestic manufacturing capabilities.
Majhi highlighted that Odisha is increasingly attracting global attention, with companies like Intel, Lockheed Martin, and Applied Materials associated with the project ecosystem. He added that the state has already secured semiconductor investments worth over ₹10,000 crore, with firms such as RIR Power Electronics and SiCSEM setting up operations.
Positioning Odisha as a strategic hub, Majhi said the state would play a crucial role in advancing Narendra Modi’s vision of a self-reliant India. He emphasised that strong infrastructure, skilled manpower, and investor-friendly policies are driving this growth.
Officials said the upcoming unit will have the capacity to produce 70,000 glass panels, 50 million assembled units, and over 13,000 advanced 3DHI modules annually once operational.
