Odisha Signs MoU With Intel, 3DGS For Advanced Semiconductor Substrate Project
Bhubaneswar/New Delhi: Odisha has received a major boost in its efforts to emerge as a semiconductor manufacturing hub with the signing of a strategic Memorandum of Understanding (MoU) involving the State Government, global chipmaker Intel and US-based 3D Glass Solutions (3DGS) for bringing advanced substrate manufacturing technology to India. The development was announced by Union…
