Bhubaneswar: The Union Cabinet, chaired by Prime Minister Narendra Modi, on Wednesday approved four new semiconductor projects under the India Semiconductor Mission (ISM), marking a major push towards self-reliance in chip manufacturing.
With a cumulative investment of about ₹4,600 crore, these projects are expected to generate direct employment for 2,034 skilled professionals and create numerous indirect jobs, strengthening India’s growing electronics manufacturing ecosystem.
The approvals take the total number of sanctioned semiconductor projects under ISM to 10, with overall investments of around ₹1.60 lakh crore spread across six states.
Two of the newly approved units—by SiCSem Pvt. Ltd. and 3D Glass Solutions Inc.—will be set up in Info Valley, Bhubaneswar, Odisha. SiCSem, in collaboration with UK-based Clas-SiC Wafer Fab Ltd., will establish India’s first commercial Silicon Carbide (SiC)-based compound semiconductor fab with an annual capacity of 60,000 wafers. These products will have applications in defence systems, electric vehicles, railways, fast chargers, data centres, consumer appliances, and solar power inverters.
3D Glass Solutions will set up an advanced semiconductor packaging and embedded glass substrate facility, introducing cutting-edge technologies like glass interposers, silicon bridges, and 3D Heterogeneous Integration (3DHI) modules to India.
The other two projects include a semiconductor manufacturing unit by Advanced System in Package Technologies (ASIP) in Andhra Pradesh, in collaboration with South Korea’s APACT Co. Ltd., and an expansion of Continental Device India Pvt. Ltd.’s (CDIL) discrete semiconductor facility in Mohali, Punjab.
The government said these approvals would significantly contribute to meeting the growing domestic demand for semiconductors across telecom, automotive, data centres, consumer electronics, and industrial sectors—advancing the vision of an Atmanirbhar Bharat.
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