Assam Set to Host First Semiconductor Packaging Plant Valued at Rs 25,000 Crore: Union Minister Rajeev Chandrasekhar

Guwahati: Union Minister of State for Electronics and IT, Skill Development & Entrepreneurship, and Jal Shakti, Shri Rajeev Chandrasekhar, revealed today that Assam is on the verge of establishing its maiden semiconductor packaging plant, a project valued at nearly Rs 25,000 Crore. The announcement was made during his address at the inaugural Digital India future SKILLS Summit held at the Birinchi Kumar Baruah Auditorium, Gauhati University.

Attributing the initiative to the leadership of Chief Minister Hemanta Biswa Sarma, the Minister stated that the semiconductor packaging plant would be developed through collaboration between the Assam Government and the TATA Group. The proposal is expected to undergo requisite approvals, following which it will be submitted to the cabinet for final sanction. This development aims to provide young Indians in Assam with opportunities in the semiconductor industry without the need to relocate to other cities.

Minister Chandrasekhar highlighted the significant economic progress India has made under the leadership of Prime Minister Narendra Modi, evolving from the ‘fragile 5’ to one of the world’s ‘top 5’ economies. He underscored the growing opportunities in emerging technology sectors such as AI, cybersecurity, and semiconductors. Leading global companies like NVIDIA, Intel, AMD, HCL, Wipro, and IBM were present at the summit, conveying a unanimous message about the abundant job opportunities. The Minister’s objective with the summit was to inspire young Indians to equip themselves with skills in these crucial areas.

The Minister also outlined India’s three-pronged strategy under the guidance of PM Modi to shape the future of technology, involving futureDESIGN for design innovation, futureLABS for systems innovation, and futureSKILLS for preparing the youth with capabilities in emerging sectors.

During the summit, esteemed speakers included officials such as Sh. Kuntal Sensarma, Economic Adviser, MeitY, Ms. Jaya Jagadish, Head, AMD India, Shri. Ruchir Dixit, Vice President & Country Manager, Siemens EDA, Shri Lingraju Sawkar, President, Kyndryl India, Shri. Ganesh Gopalan, CEO and Co-Founder, Gnani.AI, and Prof. Subhasis Chaudhuri, Director, IIT Bombay.

Hon’ble Minister of Education, Govt. of Assam, Dr. Ranoj Pegu, disclosed that the Assam Government has taken substantial steps for digital skilling of the youth. Projects worth Rs. 1800 crore have been implemented for skilling across 77 polytechnics and ITIs. Additionally, an agreement has been signed with TATA, allocating 150-acre land near Guwahati for a semiconductor industry.

The summit witnessed over 30 strategic collaborations between NIELIT and industry leaders like Intel, HCL, Microsoft, Kyndryl, IIM Raipur, IIITM Gwalior, and Wipro, aiming to bridge the gap between academia and industry. The event showcased innovative future skills technologies and solutions and facilitated interactions between startups, academia, and industry representatives.

The summit aligned with the government’s vision to transform India into a global talent hub, fostering talent development in emerging technologies.